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  • Shop MFU01 PS
  • 2021031216512122

PS Series PS Processing

PS Series PS Processing is Pico-second processing equipment. It is a special product specially developed for the needs of low power pico-second level, high precision and fast processing. It is widely used in thin materials, ceramic drilling and scribing, glass ink removal, coating removal, dazzling marks, micro and invisible two-dimensional code marks, and fine scribing and cutting of thin film materials
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Product details

Technical parameter

Product application

PS Series PS Processing is Pico-second processing equipment. It is a special product specially developed for the needs of low power pico-second level, high precision and fast processing. 


Features and advantages:

Narrow pulse width, applicable for fine machining. Pico-second laser can make Ultra-fast processing.


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Model

HY-MFU01

Laser type

UV

Infrared

Green

Ave Output Power (W)

5-30

30

15

Laser Wavelength (nm)

355

1064

532

Pulse repetition rate (KHZ)

400K-1M

200~1000

200~1000

Pulse Width (PS)

10

10

10

Scanning Speed(mm/s)

≤7000

≤7000

≤7000

Focus Lens(mm)

F=170

F=170

F=170

Marking area(mm)

105×105

105×105

105×105

Mini. line width(mm)

0.01

0.01

0.01

Mini. Letter Size(mm)

0.1

0.1

0.1

Cooling Method

Water Chiller

Water Chiller

Water Chiller

It is widely used in thin materials, ceramic drilling and scribing, glass ink removal, coating removal, dazzling marks, micro and invisible two-dimensional code marks, and fine scribing and cutting of thin film materials.

Applicable for high precision marking and cutting of glass / display panel, high precision marking of ceramics, etc.



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